Umpire Board Top

Umpire Board Bottom

The Umpire Test Vehicle was developed by Foresite in 1995 as a substrate by which to evaluate electronics assembly processes.  This development was undertaken due to the deficiencies of test vehicles (e.g. IPC-B-36) found in other process qualification documents (e.g. J-STD-001).  This document outlines what the Umpire board is and the salient features of the board.

Features

The Umpire board is a double-sided board with a total of 16 test sites for SIR testing:

• Three (3) IPC-B-24 test patterns.

• No mask ((laminate/flux interactions) to correlate with J-STD-004 SIR tests.

• Striped mask (solder mask developing check and entrapment effects).

• Full mask (effect of flux on solder mask properties).

• A row of 0805 chips (1.0 meg ohm, 0.1 watt) – used for checking for electromigration under caps and adhesive characteristics.

• A row of 1206 chips – same.

• Three (3) header patterns – used to study paste qualities, effects of peelable latex mask, or touch-up soldering operations.

• One (1) BGA test pattern using an isolated die (tests for residues under BGAs).

• One (1) QFP test pattern using an isolated die (residues under QFPs).

• One LCC test pattern (tests for low stand off cleaning challenges) – identical to IPC-B-36 quadrant D patterns.

• One (1) row of DIPs for through hole processes (checks for fillet formation).

• One (1) PGA socket – used to examine entrapment effects of sockets.

• A snap-off coupon containing a Bellcore pattern with crosshatched mask – used to test SIR per Bellcore CR-78-CORE for telecommunications assemblers.

• A snap-off coupon containing an IPC-B-36 Quadrant D pattern – used for military and IPC Class 3 customers for J-STD-001 qualification.

For more information about the Umpire board, please contact Foresite - email: foresiteinfo@residues.com

or call (765)457-8095